KD Market
Insights has
published a new report on Wafer Backgrinding Tape Market analysis and forecast 2019-2026. The
report comprises of Wafer Backgrinding Tape Market size, Y-o-Y growth analysis,
and market dynamics, including growth drivers, restraining factors,
opportunities, and trends which are spearheading current nature and future
status of the market.
The global wafer backgrinding tape market size is expected
to reach $261.4 million by 2026, growing at a CAGR of 4.9% from
2019 to 2026. Wafer backgrinding is an integrated process in the fabrication of
semiconductor devices. Prior to the process of backgrinding, wafers are
laminated by different type of backgrinding tapes to avoid surface damage in
the process of backgrinding and also protect from the wafer surface
contamination caused by infiltration of grinding fluid. Minimization of various
semiconductor components requires the use of wafer backgrinding significantly.
Therefore, with technological advancement and usage of more compact &
portable devices, backgrinding has become crucial stage of wafer designing
& integration. Thus, importance of wafer backgrinding in the fabrication of
semiconductor requires wafer backgrinding tape for protecting wafer’s surface,
which in turn fuels the market growth.
Wafer backgrinding tapes fully protect the
wafer surface during backgrinding and also prevent wafer surface contamination
from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer
fabrication ensures precision in wafer thickness after backgrinding. Wafer
backgrinding tapes are mainly used in processing semiconductor wafers made from
materials such as silicon or glass. Its powerful adhesive strength keeps wafers
in place when grinding and cutting. Once the wafer has been processed, exposing
the tape to ultraviolet light (UV) reduces its adhesive strength, making tape
peeling or die pick up simple.
The factors such as increase in demand for
ultra-thin wafers, rise in need for wafer fabrication, increase in focus toward
wafer surface protection during grinding process, and growth in the
semiconductor industry boost the growth of the wafer backgrinding tape market
globally. However, increase in shift from non-UV to UV curable backgrinding
tapes that increase the overall cost of wafer manufacturing is expected to
hamper the market growth. Furthermore, increase in investment in wafer
fabrication equipment and materials, especially in Korea and China, is expected
to offer lucrative opportunities for the market expansion.
The global wafer
backgrinding tape market is
segmented on the basis of type, wafer size, and region. Based on type, the
market is bifurcated into UV curable and non-UV tape types. Based on wafer
size, the market is divided into 6-inch, 8-inch, 12-inch, and others. Based on
region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA
along with their prominent countries.
The key players profiled in the report include Furukawa Electric Co.
Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH,
Denka Company Limited, Lintec of America Inc., AI Technology, Inc.,
Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.
These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.
These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.
KEY BENEFITS FOR STAKEHOLDERS
- This study includes the analytical depiction
of the global wafer back grinding market along with the current trends and
future estimations to determine the imminent investment pockets.
- The report presents information regarding the key drivers, restraints, and opportunities.
- The current market is quantitatively analyzed from 2018 to 2026 to highlight the financial competency of the industry.
- Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
- The report presents information regarding the key drivers, restraints, and opportunities.
- The current market is quantitatively analyzed from 2018 to 2026 to highlight the financial competency of the industry.
- Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
GLOBAL WAFER BACKGRINDING TAPE MARKET SEGMENTATION
BY TYPE:
- UV Curable
- Non-UV
- UV Curable
- Non-UV
BY WAFER SIZE:
- 6-Inch
- 8-Inch
- 12-Inch
- Others
- 6-Inch
- 8-Inch
- 12-Inch
- Others
BY REGION
North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Russia
- Rest of Europe
Asia-Pacific
- China
- Japan
- Taiwan
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East & Africa
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Russia
- Rest of Europe
Asia-Pacific
- China
- Japan
- Taiwan
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East & Africa
Browse Full Report With TOC@
https://www.kdmarketinsights.com/product/wafer-backgrinding-tape-market-amr
Table of Content
CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market share analysis (2018)
3.5. Market dynamics
3.4. Market share analysis (2018)
3.5. Market dynamics
3.5.1. Drivers
3.5.1.1. Increase in demand for ultra-thin wafers
3.5.1.2. Rise in need for wafer fabrication
3.5.1.3. Increase in focus toward wafer surface protection during grinding process
3.5.1.4. Growth in the semiconductor industry
3.5.1.2. Rise in need for wafer fabrication
3.5.1.3. Increase in focus toward wafer surface protection during grinding process
3.5.1.4. Growth in the semiconductor industry
3.5.2. Restraint
3.5.2.1. Increase in cost of wafer manufacturing
3.5.3. Opportunities
3.5.3.1. Increase in investment in wafer fabrication equipment and
materials
3.6. Wafer manufacturing overview
3.7. Wafer fabrication
3.7. Wafer fabrication
3.7.1. Types of wafer fabrication process
3.7.1.1. Front-end process
3.7.1.2. Back-end process
3.7.1.2. Back-end process
3.7.2. Processes involved during wafer fabrication
3.7.2.1. Oxidation
3.7.2.2. Lithography
3.7.2.3. Deposition
3.7.2.4. Etching
3.7.2.5. Chemical Mechanical Planarization
3.7.2.6. Ion implementation
3.7.2.7. Assembly and testing
3.7.2.8. Diffusion
3.7.2.2. Lithography
3.7.2.3. Deposition
3.7.2.4. Etching
3.7.2.5. Chemical Mechanical Planarization
3.7.2.6. Ion implementation
3.7.2.7. Assembly and testing
3.7.2.8. Diffusion
3.7.3. Wafer grinding process (wafer thinning)
3.7.4. Type of wafer thinning
3.7.4. Type of wafer thinning
3.7.4.1. Conventional grinding
3.7.4.2. CMP
3.7.4.2. CMP
3.7.5. Machines and components required during wafer backgrinding
3.8. Backgrinding tapes customer applications and usage
3.8.1. Customer applications of backgrinding tape
3.8.2. Usage of backgrinding tape
3.8.2. Usage of backgrinding tape
3.9. Technology trends
3.9.1. Materials used in tapes
3.9.2. Technologies used to reduce the cycle time of backgrinding process
3.9.3. Upgrades in tape manufacturing machines
3.9.2. Technologies used to reduce the cycle time of backgrinding process
3.9.3. Upgrades in tape manufacturing machines
CHAPTER 4: WAFER BACKGRINDING TAPE MARKET, BY TYPE
4.1. Overview
4.2. UV Curable
4.2. UV Curable
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Non-UV
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE
5.1. Overview
5.2. 6-Inch
5.2. 6-Inch
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. 8-Inch
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. 12-Inch
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Others
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
Continue…
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